Stress Measurements
- pending
Tencor Stressmeter
- Thin Film Stress Measurement System
- Laser scanning to measure stress on all reflecting films by measuring the change in the radius of curvature of a (stressed) thin layer deposited on a wafer (automated stress calculation)
- Measurement of elastic constant and thermal expansion coefficient of a thin film if film & substrate thickness are known
- 2-D/3-D mapping option
- Dual wavelength measurement (670 nm & 780 nm)
- Resolution: 3e-5 m-1 (33 kilometers)
- Minimum scan step: 0.02 mm
- Minimum Radius: 2.0 m (@ 80 mm scan length)
- Chuck Size up to 8“/200 mm
- Temperature: up to 500°C
- Manual wafer load
- 3.5” floppy drive for data export (NO network access!!)