Reactive Ion Etching (RIE)

Responsibility:

RIE NGP 80:   


RIE 80:    

Reactive Ion Etching NGP80

RIE NGP 80 Insulators (Oxford Instruments)

  • Plasma etching of dielectric layers and photoresists
  • Sample size up to 6”
  • Base pressure <5x10-5 Torr
  • RF 13.56 MHz (500W) generator
  • CHF3, CF4, SF6, O2, Ar gas
  • OES (Optical Emissions Spectroscopy)
Ractive Ion Etching RIE80

RIE 80 Insulators (Oxford Instruments)

  • Plasma etching of metals, polymers and other materials
  • Sample size up to 6”
  • Base pressure < 5x10-5 Torr
  • RF 13.56 MHz (500W) generator
  • CHF3, CF4, SF6, O2, Ar, N2 gas
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