Molecular Beam Epitaxy (MBE)

Molecular Beam Epitaxy (MBE)
MBE is a a thin film crystal growth technique.
Arsenic MBE

Responsibility:

Processes:

  • Standard III-V epitaxial growth of binary and ternary semiconductor materials containing Ga, Al, In, As, Sb.
  • Only GaAs and GaAs substrates are allowed in the growth chamber.
  • Doping sources: Si, CBr4
  • Growth of thick structures is possible, e.g. DBRs and VECSEL devices.
  • Process control with RHEED, BandiT and RGA.

Responsibility:

Phosphorus Molekular Beam Epitaxy

Processes:

  • Exploratory system for a variety of binary to quinary III-V compound semiconductors
  • No silicon or sapphire subtrates are allowed
  • Sources: As, P, Sb, Ga, In, Al
  • Doping source:  Si
  • Growth of thick structures is limited to the use of P-, Sb- or As-containing materials only
  • Process control with RHEED, BandiT, optical pyrometer and RGA
VG MBE

Responsibility:

Processes:

  • Epitaxial growth of unipolar III-V compounds on InP and GaAs substrates
  • Growth chamber equipped with 10 cell ports
  • Sources: As, Ga, Al, In, Si (dopant)
  • Process control: RHEED, optical pyrometer

Responsibility:

  1.  
  2.  
UHV preparation chamber
  • Atomic hydrogen cleaning of substrate surfaces as elevated temperatures
  • Process control with RHEED and RGA
  • Effusion and cracker cell baking and storage

BandiT

Substrate temperature monitoring using BandiT (band-edge thermometry).

Responsibility:

BandiT As-MBE

BandiT P-MBE

Pyrometer

Optical temperature measurement of substrate surfaces.

Responsibility:


Wet bench for cleaning and etching of UHV (Ultra High Vacuum) parts (MBE parts only)

Responsibility:



Work bench for cleaning and working on UHV (Ultra High Vacuum) parts (MBE parts only)

Responsibility:

Flow box for preparing holders and wafers (MBE only)

Responsibility:

Circulating air oven for drying UHV (Ultra High Vaccum) parts (MBE only)

Responsibility:

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