Wafer Cleaning
Responsibility:
Ultra-Violet Ozone Cleaning (UVOCS)
UV ozone cleaning for organic contaminants and photoresist residues
- 185nm and 254nm UV light generated by a low-pressure mercury vapor lamp
- Damage-free clean surface for III-Vs
- Sample size up to 10 inch
- Room temperature process
O2 Plasma Asher; Technics Plasma 100-E
- O2 ashing of organic residues and photoresists on III/V substrates
- 2.45 GHz 250W µW source
- O2 gas, CF4 planned
- Base pressure ~ 5 mTorr