Characterization CLA

FEI SEM, Nova NanoSEM 450

• Magnification: 30x to 500,000x
• Electron Gun: FEG with ultra-high brightness Schottky field emitter
• Extracting Voltage (Vext): 0 to 5 kV
• Acceleration Voltage (Vacc): 200 V to 30 kV (in deceleration mode: down to 50 V possible)
  
• Lens mode: default: field-free, advanced option: immersion mode for ultra-high resolution imaging
  
• Detectors: ETD (default detector for field-free mode), TLD (default detector for immersion mode), detection of secondary electrons (SE) and back scattered electrons (BSE) possible
  
• Chamber: Al with motorized 150 x 150 mm high precision and high stability stage and in-chamber camera
• Stage: All 5 axes fully motorized, tiltable, possibility to mount up to 4 samples (e.g. 2 by 2 cm) or wafer
  
• Vacuum: high vacuum operation (default mode)

Basic characteristics CT scan:

• 3D X-ray computed tomography scanner
• Dual source: 160 kV and 230 kV
• High resolution: 4um (230 kV) and 0.4 µm (160 kV)
• Inspection area up to 650 x 520 mm
• Possibility to perform in-situ tests
• Different scanning modes: conventional (2D and 3D), helical, laminography, shift and stack
• Reconstruction and inspection software with artifacts correction algorithms

• Surface profiler for step height measurements
• Vertical range 1 mm
  
• Vertical resolution 1 nm
  
• Scan length 55mm (150 mm with stitching)
  
• Fully motorized
  
• 3D mapping functionality

White light interferometer, Zygo NewView 5022s

• General purpose 3D surface analyzer
• Vertical resolution: 0.1 nm
• Lateral resolution: 0.64 µm (@50X mag.)
• Image zoom: 0.4X to 2.0X
• Objectives: 5X, 20X, 50X
• Image stitching for larger area mapping