Deposition CLA
Responsibility:
- Donat Scheiwiller
- Vacant

VERA 450 H VTD
- metal thin film deposition by e-beam evaporation
- optimal layer thickness: 1 – 200 nm
- now available metals: Au, Ti, Cr, Ni
- holder for 4’’ wafer
Responsibility:
- Valentin Gantenbein
- Vacant

Electroplating setups including potentiostat/galvanostat and electrochemical tanks and cells for electrodeposition of several types of metals. More information upon consultation: Vidalp