Wafer Cutting CLA

Disco DAD 3221 Dicing Saw

Technical data:

• Sample dimensions: up to 6" diameter or 4x4" square
• Thickness: ceramics and glass up to 3 mm, Sapphire up to 2 mm
  
• Spindle revolution: 3'000 up to 40'000 RPM
  
• Kerf width for Silicon 40 microns, ceramics and glass 200 microns
  
• Index position accuracy: 0.005 mm
• Heatable bottom plate, maximum temperature 500 °C, programmable temperature ramps, temp. uniformity +/- 2%
  
• All axes fully computer-controlled
• Automatic alignment, automatic focusing, automatic kerf checking, and other image recognition functions

Allowed materials:

• Silicon
• Glass, fused silica
• Ceramics like AlN, Al₂O₃, SiC, Lithiumniobate
• Other materials only on request!

Not allowed materials:

• Toxic materials like InP, GaAs etc.
• Water pollutants like ZnO
• Metal plates